Agenda

Agenda

Agenda


2021-05-25 09:00:00

2021 CS MANTECH

 Technical Program Day 1

Blue presentations below will be presented LIVE (recordings will be posted later in the day)

All other content is pre-recorded and will be available on-demand starting at scheduled time

2021-05-25 09:00:00

****LIVE PRESENTATION****


Welcome Message

Conference Chair: Thorsten Saeger, Qorvo

Technical Program Chair: Peter Ersland, MACOM

2021-05-25 09:15:00

Session 1 - Plenary

Session Chairs: Peter Ersland, MACOM and Thorsten Saeger, Qorvo

2021-05-25 09:15:00

****LIVE PRESENTATION****


1.1 Plenary Presentation - Next Revolution in Compound Semiconductor Materials

Mark Rosker, Defense Advanced Research Projects Agency (DARPA)

William Palmer, Defense Advanced Research Projects Agency (DARPA)

Tsu-His Chang, HetInTec Corp.

Joseph Mauer, MBO Partners

Justin Hodiak, MBO Partners

2021-05-25 10:00:00

Break - 20 minutes

2021-05-25 10:20:00

****LIVE PRESENTATION****


1.2 Plenary Presentation - Challenges and Opportunities in Remote Epitaxy for Releasable Epilayers on Graphene

Jeehwan Kim, MIT

2021-05-25 13:30:00

Session 2 - Epi Manufacturing and Test

Session Chairs: Matthew Tyhach, Raytheon and Barry Wu, Keysight

2021-05-25 13:30:00

2.1 (Invited) GaN-on-Diamond Design for Manufacturing

Daniel Francis, Frank Lowe, and Kyle Graham, Akash Systems

2021-05-25 13:30:00

2.2 Hybrid NH3/N2 Molecular Beam Epitaxy with Artificial Intelligence Assisted RHEED Analysis

Young-Kyun Noh, Hong-Kyun Noh, Byung-Guon Park, Seullam Kim, IVWorks Co.

Cheng-Yu Chen, Tsung-Pei Chin, Wei Li, Yung-Chung Kao, IntelliEpi Inc.

2021-05-25 13:30:00

2.3 Commercial N-polar GaN on SiC HEMT Epitaxial Wafers Manufactured by MOCVD for 5G mm-Wave Applications

Xiang Liu, Brian Romanczyk, Stacia Keller, Brian Swenson, Ron Birkhahn, Geetak Gupta, Davide Bisi, Umesh Mishra, Lee McCarthy, Transphorm Inc.

2021-05-25 13:30:00

Vendor Presentation 1 - Ion Technology Center Co., Ltd.

2021-05-25 13:30:00

Vendor Presentation 2 - Evatec AG

2021-05-25 13:30:00

2.4 The Phenomenon of Charge Activated Visibility of Electrical Defects in 4H-SiC; Application for Comprehensive Non-Contact Electrical and UV-PL Imaging and Recognition of Critical Defects

M. Wilson1, D. Greenock2, D. Marinskiy1, C. Almeida1, J. D’Amico1, J. Lagowski1, 1Semilab SDI, 2X-Fab

2021-05-25 13:30:00

2.5 A Deep Learning-based Multi-Model Method for Etching Defect Image Classification

Shih-Kuei Chou, Yuan-Hsin Lin, Wen-Hsing Liao, Yu-Min Hsu, Chi-Hsiang Kuo, Cheng-Kuo Lin, WIN Semiconductors Corp.

2021-05-25 13:30:00

2.6 Kelvin Force Microscopy and Micro-Raman Correlation Study of Triangular Defects in 4H-SiC

D. Marinskiy, M. Wilson, C. Almeida, S. Savtchouk, J. Lagowski, Semilab SDI

S. Toth, Z. Szekrenyes, L. Badeeb, A. Faragó, Semilab ZRT

2021-05-25 13:30:00

Session 3 - Process and Packaging

Session Chairs: Andy Carter, Teledyne Scientific and Alex Smith, Brewer Science

2021-05-25 13:30:00

3.1 (Invited) Fabrication of High-Performance Compound Semiconductor RF Circuits Using Heterogeneously-Integrated Transistor Chiplets in Interposers

Florian Herrault, HRL Laboratories, LLC

2021-05-25 13:30:00

3.2 Wafer-Level Packages for GaN Technologies & On Wafer Humidity Test

Hermann Stieglauer, Klaus J. Riepe, Janina Moereke, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, United Monolithic Semiconductors GmbH

Benoît Lambert, Jerome Van de Casteele, Mehdy Neffati, United Monolithic Semiconductors SAS

Ulli Hansen, Simon Maus, MSG Lithoglas GmbH

2021-05-25 13:30:00

3.3 Wafer Breakage Reduction in Cu Bump Processing of GaAs Technologies

Chang’e Weng, Tina Kebede, April Morilon, Jesse Walker, Kris Zimmerman, Lee Tye, John Coudriet, Josh Ochoa, Jeff Moran, Matthew Porter, Kenneth P. Reis, Qorvo

2021-05-25 13:30:00

Vendor Presentation 3 - Brewer Science, Inc.

2021-05-25 13:30:00

Vendor Presentation 10 - BISTel America

2021-05-25 13:30:00

3.4 Seeing the World from a Drop of Water: A Novel Environment-Protecting Technique for Photoresist Strip, Metal Lift-off, and Etching Byproduct Removal

Jia-You Lo, Yang-Hao Chen, Bill Chuang, Willy Chiou, Alex Weng, Kyle Chen, WIN Semiconductors Corp.

2021-05-25 13:30:00

3.5 LOL 1000 Liftoff Resist as an Antireflective Coating for MMIC Electroplating

Elizabeth Werner1, Daniel Brooks2, Kyle Liddy2, Robert Fitch Jr.2, James Gillespie2, Dennis Walker Jr.2, Antonio Crespo2, Daniel M. Dryden1, Andrew Green2, Kelson Chabak2, 1KBR, 2Air Force Research Laboratory, Sensors Directorate

2021-05-25 13:30:00

3.6 Theoretical Study of Recoil-Implanted N Atoms in Mg-Implanted GaN

Kai C. Herbert1, Kazuki Shibata1, Joel T. Asubar2, Masaaki Kuzuhara1, 1Kwansei Gakuin University, 2University of Fukui

2021-05-25 16:00:00

****Live Q+A for Session 2 & 3 Papers****

Please join to ask the authors live questions and hear their responses!

2021-05-26 09:00:00

2021 CS MANTECH

 Technical Program Day 2

Blue presentations below will be presented LIVE (recordings will be posted later in the day)

All other content is pre-recorded and will be available on-demand starting at scheduled time

2021-05-26 09:00:00

Session 4 - Plenary 2

Session Chairs: Peter Ersland, MACOM and John Blevins, Air Force Research Laboratory

2021-05-26 09:00:00

****LIVE PRESENTATION****


4.1 Plenary Presentation - Progress Towards Prolonged IC Deployment Into Previously Inaccessible Hostile Environments Via Development of SiC JFET-R ICs

Philip Neudeck, NASA Glenn Research Center

D. Spry, NASA Glenn Research Center

M. Krasowski, NASA Glenn Research Center

L. Chen, Ohio Aerospace Institute

2021-05-26 09:50:00

4.2 The Rise of Power SiC and GaN Market and The Impact of COVID-19

A.B.Slimane, E. Dogmus, P. Chiu, C.Troadec, Yole Développement

2021-05-26 09:50:00

4.3 (Invited) Processing Choices for Achieving Long Term IC Operation at 500° C

D. Spry, P. Neudeck, NASA Glenn Research Center

2021-05-26 09:50:00

Vendor Presentation 6 - Nanotronics

2021-05-26 09:50:00

4.4 Monolithically Integrated GaN Power and RF ICs on 150mm Poly-AlN for Envelope Tracking Power Amplifier Applications

Chong-Rong Huang, Hsien-Chin Chiu, Chia-Hao Liu, Hsiang-Chun Wang, Hsuan-Ling Kao, Chang Gung University

Ming-Chin Chen, Chia-Cheng Liu, Unikorn Semiconductor Corporation

Vladimir Odnoblyudov, Qromis, Inc.

2021-05-26 11:40:00

****Live Q+A for Session 4 Papers****

Please join to ask the authors live questions and hear their responses!

2021-05-26 12:00:00

Break - 1 hour 30 minutes

2021-05-26 13:30:00

Session 5 - Devices 1: GaN

Session Chairs: Fabian Radulescu,Wolfspeed and Serge Karboyan, Nexperia

2021-05-26 13:30:00

5.1 Performance of 0.3 µm Gate Length GaN HEMT by Using i-line Stepper for High Power C-band Applications

Sangmin Lee, Byoungchul Jun, Chulsoon Choi, Hyeyoung Jung, Seokgyu Choi, Min Han, Hogeun Lee, Myoungkeun Song, Jihun Kwon, Myungsoo Park, Sungwon Lee, Yongjae Kim, Sewon Hwang, Hangyol Ji, Insup Kim, Jinman Jin, Kyeongjae Lee, Jun-Hyeok Lee, Wavice Inc.

2021-05-26 13:30:00

5.2 Investigation of Un-doped GaN Cap Layer on RF and Trap Related Characteristics in AlGaN/GaN HEMTs

Wen-Hsin Wu, Yong-Han Lin, Chieh-Chih Huang, Che-Kai Lin, Fan-Hsiu Huang, Wei-Chou Wang, WIN Semiconductors Corp.

2021-05-26 13:30:00

5.3 Analysis of GaN-HEMT DC-Characteristic Alterations by Gate Encapsulation Layer

Hossein Yazdani, Serguei Chevtchenko, Ina Ostermay, Joachim Würfl, Ferdinand-Braun-Institut (FBH)

2021-05-26 13:30:00

Vendor Presentation 7 - Forge Nano

2021-05-26 13:30:00

Vendor Presentation 9 - C&D Semiconductor Services

2021-05-26 13:30:00

5.4 Improved Gate Reliability Normally-Off p-GaN/AlN/AlGaN/GaN HEMT with AlGaN Cap-Layer

Chia-Hao Liu, Hsien-Chin Chiu, Hsiang-Chun Wang, Hsuan-Ling Kao, Chong Rong Haung, Chang Gung University

2021-05-26 13:30:00

5.5 Temperature Dependent Measurement of GaN Impact Ionization Coefficients

L. Cao, Z. Zhu, G. Harden, H. Ye, J. Wang, A. Hoffman, P. Fay, University of Notre Dame

2021-05-26 13:30:00

5.6 High Thermal Dissipation Normally-off p-GaN Gate AlGaN/GaN HEMTs on 6-inch N-doped Low Resistivity SiC Substrate

Yu-Chun Huang, Hsien-Chin Chiu, Hsuan-Ling Kao, Hsiang-Chun Wang, Chia-Hao Liu, Chong-Rong Huang, Si-Wen Chen, Chang Gung University

2021-05-26 13:30:00

Session 6 - Process and Control

Session Chairs: Eric Stewart, Northrop Grumman and Michelle Bourke, Lam Research

2021-05-26 13:30:00

6.1 GaN Through-substrate Via Process for GaN-on-GaN HEMT Power Amplifiers

N. Okamoto1,2, A. Takahashi1,2, Y. Minoura1,2, Y. Kumazaki1,2, S. Ozaki1,2, J. Kotani1,2, T. Ohki1,2, N. Kurahashi2, M. Sato2, N. Hara1,2, K. Watanabe1,2, 1Fujitsu Limited, 2Fujitsu Laboratories Ltd.

2021-05-26 13:30:00

6.2 Fabrication of GaN-on-SiC Via by Using OES endpoint detection

I.Toledo, Y.Gerchman, G.Lerner, M.Vinokorov, Gal-El (MMIC)

2021-05-26 13:30:00

6.3 Implementation of End Point Detection for Compound Semiconductor Wafer Thinning Applications and Investigation of Gallium Arsenide Etch Rates and Surface Roughness

Phillip Tyler, Jonathan Fijal, Ian Cochran, John Taddei, Veeco Instruments – Precision Surface Processing

Eric Tucker, Soo Min Lee, Eric Armour, Christine Notarangelo, Veeco Instruments – MOCVD

2021-05-26 13:30:00

Vendor Presentation 11 - Canon USA

2021-05-26 13:30:00

Vendor Presentation 12 - Heidelberg Instruments

2021-05-26 13:30:00

6.4 A Systematic Approach for Determining Overlay Spec Limits in Photolithography

C. Wang, L. Huynh, F. Pool, T. Henderson, B. Lindstedt, C. Nevers, Qorvo

2021-05-26 13:30:00

6.5 Uncovering Process Interdependency Using Data Mining

Kim Kok Gan, Gabe Villareal, Joe Lee, BISTel America

2021-05-26 13:30:00

6.6 Electrostatic Discharge (ESD) in AlGaN/GaN HEMT due to Fabrication Process

Dana Baram, Adam Briga, Ksenya Zaft, Lina Ortenberg, Itzik Toledo, Yaron Knafo, Gal-El (MMIC)

2021-05-26 16:00:00

****Live Q+A for Session 5 & 6 Papers****

Please join to ask the authors live questions and hear their responses!

2021-05-24 10:00:00

2021 ROCS Workshop

 Workshop Chair: Don Gajewski, Wolfspeed, A Cree Company

All presentations below will be presented LIVE

2021-05-24 10:00:00

Welcome Remarks

Don Gajewski, Wolfspeed, A Cree Company

2021-05-24 10:10:00

HiREV – AFRL Research

Brian Poling, Air Force Research Laboratory

2021-05-24 10:30:00

Effects of External Strain on GaN-Based HEMTs Under X-Ray Irradiation

Dan Fleetwood, Vanderbilt University

2021-05-24 10:50:00

Effects of Aging on Intermodulation Distortion of a COTS GaN HEMT

Jeff Cotton, Accel-RF

2021-05-24 11:10:00

Status of “Guidelines for Space Qualification of GaN HEMT Technology”

John R. Scarpulla, Aerospace

2021-05-24 11:30:00
2021-05-24 13:30:00

ROCS 35th Anniversary

Bill Roesch, formerly Qorvo

2021-05-24 14:00:00

Reliability of 150 nm, 28 V GaN HEMT Process up to Ka-band

Satyaki Ganguly, Wolfspeed

2021-05-24 14:20:00

Estimate of III-V FET Thermal Resistance from DC Electrical Measurements using Artificial Neural Networks

Masaya Iwamoto, Keysight

2021-05-24 14:40:00

Costly Component Out Of Pocket Defect Condition During RF Semiconductor IC Transport/Handling

Darby Davis, GelPak

2021-05-24 15:00:00

Workshop Closing - Thank you for attending!!!

2021-05-27 09:00:00

2021 CS MANTECH

 Technical Program Day 3

Blue presentations below will be presented LIVE (recordings will be posted later in the day)

All other content is pre-recorded and will be available on-demand starting at scheduled time

2021-05-27 09:00:00

Session 7 - Plenary 3

Session Chairs: Yohei Otoki, SCIOCS and Mario Faria, MAX I.E.G.

2021-05-27 09:00:00

****LIVE PRESENTATION****


7.1 Plenary Presentation - Low-Temperature Direct Wafer Bonding Innovating CS Device Technologies

Naoteru Shigekawa, Osaka City University

Jianbo Liang, Osaka City University

2021-05-27 09:50:00

7.2 (Invited) Driving Lower Fiber Optical System Power Consumption through Monolithic Electronic and Optoelectronic Integration

Larry Tarof, Elphic

2021-05-27 09:50:00

7.3 How are High-Volume 3D Sensing Applications Shaping the Compound Semiconductor Industry?

E. Dogmus, A. B. Slimane, P.Chiu, P. Mukish, P.Boulay, Yole Développement

2021-05-27 09:50:00

Commercial Spot 1 - CS CLEAN SOLUTIONS Inc.

2021-05-27 09:50:00

Commercial Spot 2 - Samco, Inc.

2021-05-27 09:50:00

7.4 Rapid Capacity Simulation for Planning a 200mm III-V Giga Fab

Kok Kheong Looi, Patrick See, Ariel Meyuhas, MAX I.E.G. LLC

2021-05-27 11:40:00

****Live Q+A for Session 7 Papers****

Please join to ask the authors live questions and hear their responses!

2021-05-27 12:00:00
2021-05-27 12:20:00

****Student Forum - Live Meeting****

Students, please join us for career development discussions with industry representatives from the conference.

2021-05-27 13:20:00

Break - 10 minutes

2021-05-27 13:30:00

Session 8 - Materials and Characterization

Session Chairs: Thomas Roedle, Ampleon and Nick Dellas

2021-05-27 13:30:00

8.1 Demonstration of High-quality GaN Epitaxy on 200 mm Engineered Substrates for Vertical Power Device Fabrication

K. Geens1, H. Hahn2, H. Liang1, M. Borga1, D. Cingu1, S. You1, M. Marx2, R. Oligschlaeger2, D. Fahle2, M. Heuken2, V. Odnoblyudov3, O. Aktas3, C. Basceri3 and S. Decoutere1, 1imec, 2AIXTRON SE, 3Qromis, Inc.

2021-05-27 13:30:00

8.2 Evaluation of novel iron-free QuanFINETM structure by 100nm and 150nm AlGaN/GaN HEMT technology

Jan Grünenpütt1, Daniel Sommer1, Jörg Splettstößer1, Olof Kordina2, Jr-Tai Chen2, Herve Blanck1, 1United Monolithic Semiconductors – GmbH, 2SweGaN

2021-05-27 13:30:00

8.3 Thin Al0.5Ga0.5N/GaN HEMTs on QuanFINE® Structure

Ding-Yuan Chen1,2, Kai-Hsin Wen1,2, Mattias Thorsell2, Olof Kordina1, Jr-Tai Chen1, Niklas Rorsman2, 1SweGaN, 2Chalmers University of Technology

2021-05-27 13:30:00

Commercial Spot 5 - JST MANUFACTURING, INC.

2021-05-27 13:30:00

8.4 Low Off-state Leakage Current Normally-off p-GaN Gate HEMT Using Al0.5Ga0.5N Etching Stop Layer Design

Min-Hung Shih, Hsiang-Chun Wang, Hsien-Chin Chiu, Hsuan-Ling Kao, Chung-Yi Li, Chang Gung University

2021-05-27 13:30:00

8.5 A Study of Wafer-Scale Breakdown Characteristics of Vertical GaN PIN Rectifiers

Minkyu Cho1, Matthias A. Daeumer2, Jae-Hyuck Yoo2, Marzieh Bakhtiary Noodeh1, Qinghui Shao2, Zhiyu Xu1, Theeradetch Detchprohm1, Russell D. Dupuis1, and Shyh-Chiang Shen1, 1Georgia Institute of Technology, 2Lawrence Livermore National Laboratory

2021-05-27 13:30:00

8.6 Using the CnCV Technique to Explore AlN as an Alternative Passivation Layer in GaN HEMT Technology

Marshall Wilson, Semilab SDI

Hocine Ziad, ON-Semiconductor

2021-05-27 13:30:00

Session 9 - Devices 2: Filters and Photonics

Session Chairs: Corey Nevers, Qorvo and Steve Mahon, Feldman Engineering

2021-05-27 13:30:00

9.1 5G Smartphone and Telecom Infrastructure Markets Are Empowered by Compound Semiconductors

P. Chiu, E. Dogmus, A.B Slimane, C. Malaquin, A. Bonnabel, C. Troadec, Yole Développement

2021-05-27 13:30:00

9.2 State-of-the-Art Etch and Deposition Processing of Highly Doped ScAlN for 5G and Wi-Fi Filter Applications

Anthony Barker, Joanne Carpenter, Scott Haymore, Kevin Riddell, Adrian Thomas, Alex Wood, SPTS Technologies Ltd

2021-05-27 13:30:00

9.3 Developing Production Process for High Performance Piezoelectrics in MEMS Applications

Andrea Mazzalai, Xiang Yao, EVATEC A. G.

2021-05-27 13:30:00

Vendor Presentation 4 - Accel-RF Instruments Corporation

2021-05-27 13:30:00

Commercial Spot 4 - PR Hoffman Machine Products Inc.

2021-05-27 13:30:00

9.4 Continual Improvement of Cumulative Yield in GaAs Wafer Fabrication

Michael Welch, Mario Faria, MAX I.E.G.

2021-05-27 13:30:00

9.5 Benzocyclobutene (BCB) Process Development and Optimization for High-Speed GaAs VCSELs and Photodetectors

Dufei Wu1, Xin Yu², Yu-Ting Peng¹, Milton Feng¹, ¹University of Illinois at Urbana-Champaign, ²Foxconn-Interconnect-Technology (FIT) U.S Research and Development Center

2021-05-27 13:30:00

9.6 Standing Wave Engineering for Mode Control in Single-Mode Oxide-Confined Vertical-Cavity Surface-Emitting Lasers

Kevin Pikul, Patrick Su, Mark Kraman, Fu-Chen Hsiao, John M. Dallesasse, University of Illinois at Urbana-Champaign

2021-05-27 16:00:00

****Live Q+A for Session 8 & 9 Papers****

Please join to ask the authors live questions and hear their responses!

2021-05-27 16:40:00

****LIVE PRESENTATION****


Conference Closing Ceremony

Thank you for attending 2021 CS MANTECH!!!

Please join us to close out the conference and hear the announcement of the 2022 conference location!

Limited Access

This Part of the conference is paid.

2021-05-24 09:00:00

2021 CS MANTECH Workshop

 Workshop Chair - Martin Kuball, University of Bristol

All presentations below will be presented LIVE

2021-05-24 09:00:00

Physics, Design and Processing of Smart Power GaN Devices

Paul Chow, Rensselaer Polytechnic Institute (RPI)

2021-05-24 10:00:00
2021-05-24 10:15:00

Epi Development on the Example of an p-GaN e-mode HEMT on 200mm Si

Hu Liang, IMEC

2021-05-24 11:15:00

Break - 15 minutes

2021-05-24 11:30:00

GaN HEMT Measurement Techniques

Michael J. Uren, University of Bristol

2021-05-24 12:30:00

Break - 1 hour

2021-05-24 13:30:00

Power Device Packaging

Christoph Bayer, Fraunhofer Institute for Integrated Systems and Device Technology IISB

2021-05-24 14:30:00

Break - 15 minutes

2021-05-24 14:45:00

RF Device Packaging

Quinn Martin, MACOM

2021-05-24 15:45:00

Break - 15 minutes

2021-05-24 16:00:00

Physics-Based Modeling to Enable Device and Circuit Co-Design

Ujwal Radhakrishna, Texas Instruments

2021-05-24 17:00:00

Workshop Closing - Thank you for attending!!!